IEEE 2018 ISPCE-CN

IEEE International Symposium
on Product Compliance Engineering-Asia

VENUE

The ISPCE-CN 2018 conference will take place at The City University of Hong Kong & Harbin Institute of Technology,Shenzhen.

The City University of Hong Kong

The first day of the conference will be held on 5 Dec 2018 at City University of Hong Kong.

Address

Room P4701, 4/F,. AC1, City University of Hong Kong, 83 Tat Chee Avenue, Kowloon, Hong Kong SAR


More information on how to reach FEUP:
Traveling & Transport
https://sigarra.up.pt/feup/en/web_base.gera_pagina

Harbin Institute of Technology,Shenzhen

On 6-7 Dec 2018, the conference will be held at the Bld G, HIT Campus Shenzhen.

Address

HIT Campus of University Town of Shenzhen, Shenzhen, China


More information on how to reach FEUP:
Traveling & Transport
http://en.hitsz.edu.cn/Find_Out_More/Visit_Tips.htm